Xiaomi has announced a few days ago that it will present the Mi 9 smartphone in China on February 20 and yesterday we learned that the international presentation will take place in Barcelona on February 24, a day before MWC 2019 starts.
One of the co-founders of Xiaomi has shared yesterday some images of the device in which we could see its back, which, in the words of the manager, "will have a holographic technology of nano-laser engraving and a double nano-coating to create a unique color".
Today, we have seen new images that partially show the front of the device. In them we can see that the new Xiaomi Mi 9 will have a very thin "chin", something that we do not always find in Android smartphones.
In fact, it seems that the chin of the Mi 9 will have a thickness of only 3.6 mm, which is 40 percent less than the Mi 8.
Other specifications that we will see are the Snapdragon 855 processor, memory / storage options from 6GB / 128GB, triple rear camera with 48MP main camera and fast battery charge of 27W.
It is also believed that there will be a special version with 12GB of RAM and a transparent back cover.
Place comments
0 Comments
You are currently seeing only the comments you are notified about, if you want to see all comments from this post, click the button below.
Show all comments